摘要
集成电路的不断发展使得互连线的随机工艺变化问题已经成为影响集成电路设计与制造的重要因素。基于电报方程建立了工艺变化下互连线的分布参数随机模型,推导出互连线ABCD参数满足的随机微分方程组,并提出了基于蒙特卡洛法的互连线ABCD参数统计分析方法,通过对ABCD参数各参量系数的正态性进行偏度-峰度检验,给出了最差情况估计。实验结果表明所提出的互连线随机模型及统计分析方法可以对工艺变化下的互连线传输性能进行有效的评估。
With the great development of Integrated Circuits（IC）,random process variations of interconnects has been an important factor which impacts the IC design and manufacture.On the basis of telegraph equation,the stochastic interconnect model with distributed parameters is proposed in the presence of process variations.The stothastic differential equation of the ABCD parameters is derived,and Monte Carlo method based statistical analysis method for the ABCD parameters is presented.Jarque-Bera test is made for the normality,and the worst-case estimation is given.Experimental results demonstrate that the proposed stochastic model and the statistical analysis method can evaluate the transmission performance of interconnects in the presence of process variations effectively.
出处
《南京邮电大学学报（自然科学版）》
2009年第6期85-90,共6页
Journal of Nanjing University of Posts and Telecommunications：Natural Science Edition
基金
南京邮电大学引进人才基金(NY207025)资助项目
关键词
互连线
电报方程
随机建模
随机微分方程
蒙特卡洛法
interconnects
telegrapher s equation
stochastic modeling
stochastic differential equation
Monte Carlo method
