摘要
采用真空蒸发方法在硅油表面制备了一种具有自由支撑边界条件的铜薄膜系统并研究了其成膜机理和带状有序结构。实验发现:此类铜薄膜的生长机制近似服从二阶段生长模型。进一步实验发现:铜分枝状凝聚体在大气中作无规扩散和旋转,直到在某处堆积或者连接。在该连续铜薄膜系统中,我们观察到了带状有序结构。该有序结构是由一系列长度基本一致而宽度不尽相同的平行键块组成。实验结果表明:该有序结构是在样品被取出真空腔之前,由于液体基底的收缩导致薄膜压应力而形起的。理论推测铜薄膜中可能同时存在一系列不同类型的正弦型内应力分布,而这种内应力分布最终导致带状有序结构的形成。
A nearly free sustained copper （Cu） film system has been fabricated by thermal evaporation of Cu atoms on silicone oil surfaces and its formation mechanism as well as ordered patterns has been studied. The result indicates that formation mechanism of the Cu films obeys the two-stage growth model. The further studies show that the Cu aggregates diffuse and rotate randomly in the air until they assemble or connect each other The ordered patterns, which are composed of a large number of parallel keys with different width but nearly uniform length, are observed in the continuous Cu films. The experiment shows that the ordered patterns are induced by the compressive stress in the film owing to contraction of the liquid surface before the samples are taken from the vacuum chamber. The theoretical studies show that various sinusoidal stress-relief patterns, which finally result in the formation of the ordered patterns, may exist simultaneously in the Cu films on liquid surfaces.
出处
《台州学院学报》
2009年第3期29-34,43,共7页
Journal of Taizhou University
基金
国家自然科学基金项目(50701037)
浙江省自然科学基金项目(Y7080042)
关键词
铜薄膜
液体基底
表面形貌
生长机制
thin film
liquid substrates
surface morphologies
growth mechanism
