摘要
AlN陶瓷因具有高热导率、低介电常数、与硅相匹配的热膨胀系数等优异性能,被认为是替代Al2O3和BeO陶瓷的理想基板材料。主要讨论了AlN陶瓷的导热机理及影响热导率的因素;介绍了AlN陶瓷烧结助剂的选取原则、几种烧结助剂的作用机理及优缺点,并从高温烧结助剂体系和低温烧结助剂体系2个方面介绍了AlN陶瓷研究的最新进展。
AlN ceramics attracts particular interest as a promising packaging substitute for Al2O3 and BeO due to its specific properties of high thermal conductivity, low dielectric constant and a matching thermal expansion with silicon. The heat conduction mechanisms of AlN and possible influencing factors of thermal conductivity are mainly discussed. In addition, the selection principle and mechanisms of sintering additives, as well as merits and demerits of these sintering additives are reviewed. Finally, sintering additives are divided into two systems, the high-temperature sintering additives and the low-temperature sintering additives to introduce the new progress of AlN ceramics.
出处
《材料导报》
EI
CAS
CSCD
北大核心
2009年第17期56-62,共7页
Materials Reports
基金
国家自然科学基金(50871025)
辽宁省自然科学基金(20051075)
关键词
ALN
热导率
烧结助剂
AlN ceramics, thermal conductivity, sintering additives
