摘要
采用电子陶瓷工艺制备了一系列钙长石／玻璃复合材料，并对复合材料进行X射线分析、扫描电镜观察和性能测试。结果表明：复合材料的介电常数、热膨胀系数随钙长石含量的增加而增加，而介电损耗和抗折强度随钙长石含量的增加而减小。钙长石含量大于50wt％的复合材料中α-石英和方石英的析出增加了材料的热膨胀系数，但对材料的介电性能影响不大。所制备的复合材料具有低的介电常数（5．4～6．1）、低的介电损耗（0．11％～0．41％）、低的热膨胀系数（4．3×10^-6～6．1×10^-6／℃）和低的烧结温度（≤900℃），有望用于电子封装领域。
A series of anorthite/glass composites were prepared using electronic ceramics process. The phase and microstructure evolution of the composites were characterized by X--ray diffraction and scanning electron microscope. The properties of the composites were also measured. The results show that the dielectric constant and thermal expansion coefficient increased, the dielectric loss and bending strength desreased with the increasing of anorthite content. The formation of a--quartz and cristob-＂ alite during the sintering process in composites containing over 50% （in mass） anorthite content en- hances thermal expansiong however, it has little influence on the dielectric property of the composite. The obtained composites showed a low dielectric constant（5.4～6.1）, low dielectric loss（0.11%～ 0.41%） and low thermal expansion coefficient（4.3×10^-6～6.1×10^-6/℃） as well as low--tempera- ture sintering behavior（≤900℃）, which indicates that they could be applicable as dielectric and substrate materials.
出处
《山东陶瓷》
CAS
2009年第4期3-6,共4页
Shandong Ceramics
关键词
玻璃/陶瓷复合材料
钙长石
电子封装
介电性能
Glass/Ceramic Composite Material
Anorthite
Electronic Packaging
Dielectric Property
