摘要
LED作为第四代照明光源已被广泛应用于显示和照明系统设备,但由于其光电转化率较低,大部分电能实际转化成了热量,所以如何提高其散热能力是大功率LED实现产业化亟待解决的关键技术之一。文章以某公司LED路灯为模型,采用ANSYS有限元软件对其进行参数化建模及热分析,得出了其稳态的温度场分布,在此基础上通过设计正交实验,分析了铝制热沉不同结构参数对其温度场的影响情况。由最终的结果可知,在合适的范围内使散热器翅片的厚度和间距较小一些,可得到较为理想的优化结构,既能控制芯片的最高温度,又有效地减小了散热器的质量。文章LED路灯算例得到优化的质量为原质量的33.40%。
Light-emitting Diode（LED）, the fourth generation fight, has already been widely used in illtunination devices, but the Iransformation efficiency of electricity to light is still low, so how to improve the capability of the heat sink become one of the key technical issues for the industrialization of high-power LED. Based on a real street lamp of LED company, a parameterized model and thermal analysis with ANSYS software for high-power LED was obtained. The steadystate temperature fields of LED with difference of structure dimensions of the heat sink were compared using orthogonal experimental design, and an optimized model which can not only limit the highest temperature on LED, but also decrease the mass of the heat sink was obtained by reducing the thickness and separation of fins of the heat sink. A case analysis of LED street lamp shows that optimized weight reduces to 33.40% of original weight.
出处
《电子与封装》
2009年第5期44-48,共5页
Electronics & Packaging
关键词
大功率LED
热沉
热分析
high-power LED
heat sink
thermal analysis
