摘要
埋头焊接是针对通孔插装元器件的一种特殊焊接方法。介绍了埋头焊接的优点,通过UG软件建立了电路板和焊点的三维有限元模型,利用焊点在近似试验载荷条件下的应力应变三维有限元数值模拟,就"先剪后焊"埋头焊接方法形成的焊点和普通焊点强度做了对比,给出了焊点的应力变化,并结合振动分析试验、温度循环试验和基于2D图像的X射线检测和分析,证明了埋头焊接方法应用的可行性。
Flush soldering is a special method for through hole compnent. Introduce the merit of flush soldering. The finite element model （FEM） of global PCB and local one solder joint were based on UG software, linear dynamic, static analyses and substructure technology were used to determine the stresses and strains of the solder joints. Give the variation of stresses of the solder joints through contrasting solder joints which jointing by cutting pin first to the common solder joints. Flush soldering is being proved a possible way to jointing by vibration test and cyclic temperature test and 2D X -ray inspection technique for PCB solder joints.
出处
《电子工艺技术》
2009年第3期147-150,共4页
Electronics Process Technology
关键词
通孔插装元器件
埋头焊接
可靠性
分析
Through hole compnent
Flush soldering
Reliability
Analysis
