摘要
在电子设备的研制和设计阶段,热测试与分析是热设计中的重要环节。本文阐述了利用红外热像仪对电子设备关键部位进行热测试,检测电子设备内部温度分布情况,并与设计目标进行比较与纠正,从而达到热设计的最终目的。
Thermal test and thermal analysis is vital segment in the development and design of electronic system. This paper presents the way of thermal test in electronic system by thermal infrared imager to inspect the temperature distribution of inner of electronic system. By improving the thermal control means of electronic system, the design objective of thermal control can be gained.
出处
《环境技术》
2009年第2期19-23,共5页
Environmental Technology
关键词
电子设备
热设计
热像仪
electronic system
thermal test
thermal infrared imager
