4[3]Shina S, Be]base H, Walters K et al. Design of Experiments for Lead-free Materials,Surface Finishes and Manufacturing Processes of Printed Wiring Boards [D].Chicago:America SMTA, 2000 被引量：1
7[6]Moon K W, Boettinger W J, Kattner et al. Experimental and Thermodynamic Assessment of Sn-Ag-Cu Solder Alloy[J]. Electron Mater,2000,29:1 122～1 236 被引量：1
9[8]Anderson I E, Cook B A.2nd EU Lead-Free Soldering Technology Roadmap and Framework for an International Lead-Free Soldering Roadmap[J]. Soldertec at Tin Technology,2003, (2) :78～84 被引量：1
10Wang L, Yu D Q, Zhao J,et al. [J]. Mater Lett,2002, 56:1039-1042. 被引量：1
