摘要
采用电化学阻抗和极化曲线法,研究了在NaCl溶液中,钨酸钠、十六烷基三甲基溴化铵(CTAB)及十二烷基硫酸钠(SDS)的单一配方以及其复配对印刷电路板的缓蚀作用.结果表明:CTAB、SDS和钨酸钠各自的单一配方对印刷电路板(PCB)均具有一定的缓蚀作用,其中CTAB浓度为1.0×10-4mol/L,SDS浓度为5.0×10-3mol/L及350mg/L钨酸钠表现出最佳的缓蚀效率;SDS和钨酸钠属于阳极型缓蚀剂,CTAB为混合型缓蚀剂;当二者复配使用时,浓度为250mg/L钨酸钠和1.0×10-4mol/LCTAB以及300mg/L钨酸钠和5.0×10-3mol/LSDS的复配缓蚀剂的缓蚀效果最佳,复配缓蚀剂具有协同效应,并且对印刷电路板的缝隙腐蚀有一定的抑制作用.
In this paper, the typical cation surfactants, such as cetyl trimethyl ammonium bromide （CTAB） ,anion surfactant sodium dodecyl sulphate （SDS）and sodium tungstate （NazWO4 ）were studied as inhibitor for print circuit board （PCB） in neutral NaCl solution by polarization curve and electrochemical impedance spectroscopic. Moreover, the inhibition behavior of the mixture of Na2WO4, CTAB and SDS was also studied. It is indicated that CTAB, SDS and sodium tungstate all show certain inhibition effect for PCB. CTAB has a better inhibition at the concentration of 1.0 × 10^-4 mol/L, SDS exhibits a better inhibition at the concentration of 5.0 ×10^-3 mol/L, and the concentration of Na2WO4 for best inhibition is 350 mg/L. SDS and Na2WO4 both are anodic inhibitor,and CTAB is a mixed inhibitor. The mixture of 250 mg/L Na2WO4 ＋ 1.0×10^-4 mol/L CTAB or 300 mg/L Na2WO4 ＋ 5.0×10^-3 mol/L has a best inhibition behavior, appearing a synergic effect, to uniform and crevice corrosion of PCB as well.
出处
《腐蚀科学与防护技术》
CAS
CSCD
北大核心
2009年第2期170-172,共3页
Corrosion Science and Protection Technology
基金
国家自然科学基金资助课题(50731004)
