摘要
通过对射频功率、反应室压强和处理时间等参量进行实验,系统研究了等离子体处理对基片表面状态的影响.结果表明,等离子体处理可以溅射去除加工变质层,降低表面粗糙度,提高基片表面洁净度和表面能.优化后的参量证实,经等离子处理的基片比未经等离子体处理的基片镀膜后损耗平均降低34.2ppm,并且显示出良好的一致性.
By a serial of experiments of Plasma parameters such as RF power, pressure and processing time, the author systematically studied the effect of Plasma treatment on the status of the substrate surface. It is proved that plasma treatment can sputter deterioration layer off, decrease surface roughness and improve surface cleanness and energy. Experiment with optimized parameters, the result is that average loss of the mirror whose substrate is treated by plasma is lower by 34.2 ppm than the unprocessed and shows good consistency.
出处
《光子学报》
EI
CAS
CSCD
北大核心
2009年第1期194-198,共5页
Acta Photonica Sinica
基金
航空科学基金(2006ZE18012)资助
