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耐高温单组分环氧胶粘剂的研制 被引量:34

Preparation of single component epoxy adhesive with high temperature resistance
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摘要 以马来酸酐(MA)为封端剂,以2,2-双(3-氨基-4-羟基苯基)六氟丙烷(BAHPFP)、2,2-双[4-(4-氨基苯氧基)苯基]丙烷(BAPOPP)、2,2-双[4-(3,4-二羧基苯氧基)苯基]丙烷二酐(BPADA)为主原料合成了含酚羟基的聚醚酰亚胺树脂(HPEI);以HPEI为耐高温增韧剂,与N,N,N,N-四缩水甘油基-4,4′-二氨基二苯甲烷(TGDDM)、氢化双酚A环氧树脂(HBPAE)、潜伏性固化剂等配制了综合性能优异的耐高温单组分环氧胶粘剂。 Polyetherimide containing phenolic hydroxyl groups (HPEI) was synthesized by using 2,2-bis(2-amino-d-hydroxy phenyl) hexafluoro propane ( BAHPFP ), 2,2-his [ 4- ( 4-aminophenoxy ) phenyl ] propane ( BAPOPP ) and 2,2-bis [ 4 - ( 3,4 -dicarboxyphenoxy ) phenyl] propane dianhydride (BPADA) as the main raw materials and maleic anhydride(MA) as the endcapper. Meanwhile, the single component epoxy adhesive with high temperature resistance and excellent comprehensive properties was also prepared from N,N,N' N'-tetraglycidyl4,4'-diamino diphenyl methane (TGDDM), hydrogenated bisphenol A epoxy resin (HBPAE), HPEI as a high temperature resistant toughener and self-made latent curing agent.
出处 《粘接》 CAS 2008年第12期16-19,共4页 Adhesion
关键词 含酚羟基的聚醚酰亚胺树脂 环氧树脂 胶粘剂 polyetherimide containing phenolic hydroxyl groups epoxy resin adhesive
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