摘要
研究了在柔性基体PET上磁控溅射氧化铝薄膜的过程中,离子刻蚀、负偏压和溅射功率对基体温度的影响,结果表明3个参数都对基体温度产生影响,为了防止PET的受热变形,离子刻蚀功率应控制在500W以下,负偏压应控制在200V以下,溅射功率应低于1000W。
Al2O3 films were deposited by magnetron sputtering on PET flexible substrate, and the effects of ion etching, bias voltage, and sputtering power on substrate temperature were studied. Results showed that all three parameters have impacts on substrate temperature. In order to prevent from thermal deformation of PET, ion etching power, bias voltage, and sputtering power should be controlled respectively under 500W, 200V, and 1000W.
出处
《包装工程》
CAS
CSCD
北大核心
2008年第10期80-82,共3页
Packaging Engineering
基金
“十一五”国家科技支撑计划项目课题资助(2006BAD05A05)
印刷包装材料与技术北京市重点实验室开放课题(KF200705)
关键词
磁控溅射
陶瓷薄膜
基体温度
magnetron sputtering
Al2O3 film
substrate temperature
