摘要
通过对微电子共晶SnBi/Cu焊点界面的微观力学性能的表征,介绍了纳米压痕法测量硬度、弹性模量、室温蠕变速率敏感系数的方法和原理。用恒定载荷法(4mN)测量了界面各相的硬度和弹性模量,测量结果表明:焊点界面处Cu6Sn5、Cu3Sn、Cu、Bi、Sn各相的硬度平均值分别是6.0、2.8、1.6、0.7、0.3GPa;弹性模量分别为117.0、146.0、127.9、58.6、49.5GPa;共晶SnBi焊料经120℃7天时效后,硬度为0.22GPa(恒定载荷50mN),弹性模量为73GPa,室温蠕变敏感指数为0.115。
Nanoindentation of constituents in interface between eutectic SnBi and Cu substrate was conducted by means of MTS XP Nanoindenter.The hardness and modulus of Cu6Sn5,Cu3Sn,Cu,Sn,Bi were obtained at prescribed load of 4mN.They were 6.0、2.8、 1.6、0.7、0.3GPa and 117.0、 146.0、127.9、58.6、49.5GPa,respectively.The study revealed that the hardness（at prescribed load of 50mN） of eutectic SnBi solder aged at 120℃ for 7 days was 0.22GPa,modulus was 73 Gpa,while its creep rate sensitivity coefficient value was 0.115 at room temperature.
出处
《沈阳航空工业学院学报》
2008年第4期33-38,共6页
Journal of Shenyang Institute of Aeronautical Engineering
基金
辽宁省教育厅高等学校科学研究项目(项目编号:05L325)
关键词
界面
微电子焊点
无铅焊料
纳米压痕法
微电子封装
interface
microelectronic solder joint
pb-free solder alloy
nanoindentation
microelectronic packaging
