摘要
本文提出用控制电位电解技术分离除去基体,ICP—AES法同时测定高纯银中二十四种痕量杂质的新方法。本法对于基体的除去率大于99.97％,残留的银对测定没有影响;由于电解分离具有不加或很少加入试剂的优点,从而减少了样品污染;大部分元素的检出限处于0.1—10ng/ml之间;标准加入回收率为92—114％;对标样平行测定三次,相对标准偏差为3.5—18％,结果与推荐值吻合。另外本文还对电解分离的机理进行了探讨。
A new method has been developed for simultaneous determination of 24 trace impurities in high-purity silver by ICP-AES after controlled potential electrolytic removal of the matrix. The separating efficiency of matrix is more than 99.97％, and the rest of trace silver do not interfere with the determination. The detection limits of 0.1—10 ng/ml for most elements and recoveries of 92—114％ were obtained. The relative standard deviations for three replications of the standard determination were 3.5—18％. Electrolytic separation has the advantage that little or no reagent addition is required, thus reducing contamination. In addition, the mechanism of electrolytic separation has been discussed.
出处
《分析化学》
SCIE
EI
CAS
CSCD
北大核心
1989年第7期597-601,共5页
Chinese Journal of Analytical Chemistry
关键词
银
杂质
电化学分离
ICP
AES
Electrolytic separation
Silver
High-purity silver analysis
ICP-AES
Simultaneous multielement determination
