摘要
半导体技术的持续进步使片间信号传递效率成为影响整机性能的瓶颈。多芯片组件等高密度封装作为解决方案,要求封装材料具有高频低损耗、低介电常数和良好的机械性能。CaO-B2O3-SiO2系可析晶玻璃材料能够满足这些要求,并引起了人们极大的关注与研究。综述了近年来针对CaO-B2O3-SiO2系可析晶玻璃材料的技术难点、制备工艺、掺杂剂和热分析方法等多方面研究进展,提出了该体系材料需要进一步解决的问题。
The efficiency of interchip communication is now a choke point of system performance due to the continuous progress of semiconductor technology. As one of the solution, the high density package, including multichip module, requires researchers to develop package materials with low dielectric loss, low permittivity at high frequency and robust mechanical properties. The CaO-B2O3-SiO2 crystallizable glass can be one of the resorts and is in the recent focus. The research progresses like domestic dilemma, synthesis process, doping agents and thermal analysis methods are reviewed in this paper, with further attention proposed.
出处
《材料导报》
EI
CAS
CSCD
北大核心
2008年第9期43-46,共4页
Materials Reports
基金
"十一五"装备预研规划子题(51312030301)
