摘要
在典型的嵌入式系统中,难点在于系统互连级,即系统内的不同组件之间通信的速率。作为目前世界上第一个、也是惟一的嵌入式系统互连国际标准,RapidIO互连架构通过定义一种高性能包交换互连技术有效地消除了系统互连瓶颈。文中从多个方面对新一代高速互连技术——RapidIO进行了研究,在介绍其应用的基础上给出了一种利用串行RapidIO实现板间和芯片间互连的系统结构方案。
In a typical embedded system, system performance is greatly impeded by the data bottleneck at the system interconnect level, i. e. the speed at which various components communicate with each other within a system. The RapidlO interconnect architecture, the first and only international standard at the system interconnect level, eliminates this bottleneck by defining a high-performance, packet-switched interconnect technology. This paper analyzes the new-generation high-speed interconnect technology-RapidlO from various aspects. It introduces the application of this technology and puts forward a system scheme for realizing the chip-to-chip and board-to-board communications by utilizing the serial RapidlO technology.
出处
《电子科技》
2008年第9期46-49,54,共5页
Electronic Science and Technology
