摘要
“绿色”PCB生产过程,在高速设计中埋置电容的应用,高密度互连印制板塞孔工艺和填料,用于高速。
＂Green＂ PCB Production Proccsses,Implementation of Buried Capacitance in High-Speed Designs,Thc Process and Pastes tier the Via Hole Plugging of HDt PCBs,Nano and Micro filled Conducting Adhesives for z-axis Intcrconnections： New Direction for High Speed, High-density Organic Microclectronics Packaging
出处
《印制电路信息》
2008年第7期71-72,共2页
Printed Circuit Information
