摘要
为实现高密度互连印制板(HDI)制作的质量与成本最优化,实验以利用半固化片压合时直接塞埋孔方式代替传统树脂塞孔工艺制作了6层的HDI板,对层压板埋孔处进行了凹陷度、介质层厚度及耐热性能测试,并比较了树脂塞埋孔和半固化片直接塞埋孔两种工艺对板的尺寸涨缩影响。实验得出:采用半固化片直接压合塞埋孔方法制作平均孔密度低于31个/cm2,芯板厚度≤0.5mm,埋孔孔径≤0.3mm的HDI板,其可靠性等各项性能指标均能满足工艺要求。且此法不需要磨板流程从而避免了磨板对板面造成的尺寸涨缩,实际生产中,可大大降低生产成本、提高生产效率。
To optimize the quality and the fabricating cost of HDI board, the method of prepreg direct plugging buried hole without resin was adopted to 6 - layer HDI boards in this study. The concavity, the dielectric layer thickness and the thermal stabilities in buried hole area of laminated boards were investigated. Further more, the magnification influence between two approaches by resin and prepreg plug buried holes were compared. The results demonstrated that the method of direct plugging hole with prepreg can produce the HDI board whose average hole density under 37/cm2and the thickness of the core board and the diameter of blind hole is less than 0.5 mm and 0.3 mm, respectively. The performance index of laminated board such as reliability can meet the technical requirements. The stretching caused by grinding process was avoided by this way. It can be cost-effective and efficiency in practical production.
出处
《印制电路信息》
2013年第4期182-186,共5页
Printed Circuit Information
基金
广东省科技厅产学研结合项目(2012A090300007)的资助
