摘要
介绍了金层纯度及厚度、焊线孔结构、镀后清洗方式对镀金接触体可焊性的影响。提出了改变焊线孔结构设计,改进镀金工艺和规范管理镀金件镀后处理方式等保证镀层可焊性的系列措施。
The influences of the electroplated gold layer＇s purity and thickness, welding wire hole＇s structure and post-plating cleaning methods on the weldability of gold electroplated contact body were introduced. A series of measures to guarantee the electroplated gold layer＇s weldability were presented, including changing the welding wire hole＇s structure design, improving the gold electroplating process and managing the post-plating methods of gold electroplated pieces reasonably.
出处
《电镀与涂饰》
CAS
CSCD
2008年第7期29-31,共3页
Electroplating & Finishing
关键词
接插件
镀金
接触体
可焊性
connector
gold electroplating
contact body
weldability
