摘要
采用金相观察、XRD、SEM、EDS等实验方法,研究了铸态和固溶态AZ系镁合金化学镀Ni-P合金的初始沉积特点。结果表明,镀层初始沉积最先是电化学机制占主导地位,然后是次磷酸盐的还原作用机制和电化学机制并存,最后逐步过渡到以次磷酸盐的还原作用机制占主导地位。同时基体成分和组织影响着镀层的初始沉积机制和沉积速度。
The characteristics of initial deposition of electroless plating Ni-P alloy on the as-cast and solution-treated AZ magnesium alloy system were studied by optical microscopy, XRD. SEM and EDS. The results show that the electrochemical deposition plays a dominant role in the early stage of initial deposition coating, then reduction reaction and the electrochemical mechanism of hypophosphite coexist, finally reduction reaction of hypophosphite gradually play a dominant role. Meanwhile, the substrate composition and microstructure affect the initial deposition mechanism and depositing rate.
出处
《铸造技术》
CAS
北大核心
2008年第3期380-382,共3页
Foundry Technology
基金
国家自然科学基金(No.50571092)
关键词
化学镀
初始沉积机理
AZ系镁合金
Ni—P合金镀层
Electroless plating
Initial deposition mechanism
AZ magnesium alloy-system
Ni-P alloy coating
