摘要
利用金相显微镜(OM)、扫描电子显微镜(SEM)及能谱(EDS)等分析测试手段,研究AZ91D镁合金上直接化学电镀Ni-P的沉积过程。结果表明:活化后的表面上不同位置处最初沉积Ni的过程不同。在活化后的块状物上,由于氟化物的溶解,Mg置换出Ni,因此最初"块状物"上只有Ni沉积,没有P。β相和α相边缘则是由于其电位较高,附近的Ni2+得到Mg失去少量电子后还原沉积出高催化活性的Ni核,催化了次亚磷酸钠还原沉积出P和Ni。
The deposition process of electroless plating of Ni-P on AZ91D magnesium alloy was investigated by metallographic microscope, scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS). Results show that the initial deposition mechanisms of Ni-P coating in different places of the activated surface are different. There is only nickel (Ni) deposition but no P on 'massive object' generated after activation, mainly due to the dissolution of the fluorides and the replacement of Mg for Ni. For beta phase and the edge of alpha phase, adjacent Ni(2+) would gain a few electrons lost by Mg and be reduced because of electrochemical effect. The Ni nucleus with high catalytic activity provides the catalysis condition for the reduction of P and Ni.
出处
《稀有金属材料与工程》
SCIE
EI
CAS
CSCD
北大核心
2010年第9期1593-1597,共5页
Rare Metal Materials and Engineering
基金
北京市自然科学基金(2032009)
航空科学基金(03H51016)
