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WCu10型纳米复合粉的压制与烧结行为研究 被引量:2

Study on the Compacting and Sintering Behaviors of WCu10 Nanocomposite Powders
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摘要 本文对用化学方法制备的WCu10型低Cu含量W-Cu纳米复合粉末进行了压制和烧结性能方面的研究,与传统W-Cu混合粉相比较,发现该粉末具有其特殊的性质。要达到相同的压坯密度,纳米复合粉所需要的压制压力要大的多,几乎是常规W与Cu混合粉所需压力的2.5倍。而由于粉末本身高的氧含量和低的Cu含量,需在很高的烧结温度下才能达到致密化。 WCu10 alloy was synthesized by means of Powder metallurgy techniques using nanoeomposite powders. The compacting and sintering behaviors were studied. Compared with conditional micro-sealed powders, nanoeomposites express different features. Compared with the micro-sealed powders, nanoeomposites need 2.5 multiple pressure to get the same density. Because of the high content of oxygen and the low volume percent of copper, WCul0 nanoeomposite powders are difficult to be densified simplely by liquid-phase sintering.
作者 杨迎新
机构地区 江西理工大学
出处 《硬质合金》 CAS 北大核心 2007年第3期158-161,共4页 Cemented Carbides
关键词 WCu10 纳米复合粉 压制与烧结行为 WCu10,nanoeomposite powders,compacting and sintering process.
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  • 1范景莲,刘军,严德剑,黄伯云.细晶钨铜复合材料制备工艺的研究[J].粉末冶金材料科学与工程,2003,8(1):63-67. 被引量:12
  • 2曹顺华,林信平,李炯义.纳米晶W-Cu复合粉末烧结行为[J].中国有色金属学报,2005,15(2):248-253. 被引量:10
  • 3李志翔,杨晓青.W-Cu合金的最新研究进展[J].机械,2005,32(8):53-55. 被引量:17
  • 4HONG S H,KIM B K.Fabrication of W-20wt%Cu composite nanopowder and sintered alloy with high thermalconductivity[J].Materials Letters,2003,57(18):2761-2767. 被引量:1
  • 5JEDAMZIK R,NEUBRAND A,RODEL J.Functionally graded materials by electrochemical processing and infiltration:application to tungsten/copper composies[J].Journal of Materials Science,2000,35(2):477-486. 被引量:1
  • 6JOHNSON J L,GERMAN R M.Phase equilibrium effects on the enhnnee liquid phase sintering of tungsten-copper[J].Metall Trans A,1993,24A(11):2369-2377. 被引量:1
  • 7LEE G G,HA G H,KIM B K.Synthesis of high density ultrafine W-Cu composite alloy by mechano-thermochemical process[J].Powder Metallurgy,2000,43(1):79-82. 被引量:1
  • 8ZEMING H,MA J.Constitutive modeling of alumina sintering:Grain-size effect on dominant deusification mechanism[J].Computational Materials Science,2005,32(2):196-202. 被引量:1
  • 9Hong S H, Kim B K. Fabrication of W-20wt% Cu composite nanopowder and sintered alloy with high thermal conductivity. Materials Letters, 2003, 57 ( 18 ) : 2761 - 2767. 被引量:1
  • 10Jedamzik R, Neuhrand A, Rodel J. Functionally graded materials by electrochemical processing and infiltration: application to tungsten/ copper composies. Journal of Materials Science, 2000, 35:477 - 486. 被引量:1

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