摘要
阐述了一款光栅精密测量系统芯片"EYAS"的后端物理设计与实现。考虑到深亚微米工艺下的互连寄生效应,采用基于硅虚拟原型(SVP)的设计和迭代策略,以布线为中心,并适时进行全面的分析和迭代验证。采用"模拟IP"和改进的数模混合芯片设计流程,实现了模拟和数字部分的联合设计,保证了时序驱动下的持续收敛和可制造性。"EYAS"芯片采用HJTC 0.18μm工艺流片,并经板级测试成功;芯片工作频率为10 MHz,正交信号采样率为1.25 MHz,封装后芯片面积仅为1.5 mm×2.0 mm,各项功能正常稳定。以该芯片为控制内核,构建了光栅精密角度/位移测量系统,并应于火炮炮膛螺纹磨损度的精密测量。
With interconnect effects in deep-submicron technology taken into consideration, back-end design and implementation of a grating precision measurement system IC ＂EYAS＂ is presented based on SVP. With focus on routing, analysis and iteration verification were carried out timely. ＂Analog IP＂ and an improved mixed signal back- end flow were used to run the co-design between analog and digital portions, ensuring the continuous convergency and manufacturability under timing driven. EYAS was taped out with HITC＇ s 0. 18 μm technology and passed board-level test. The IC can operate at 10 MHz with 1.25 MHz sampling rate for orthogonal signals and the chip occupies an area of 1.5 mm×2. 0 mm. A grating precision angle/displacement measurement system was made using EYAS as controlling core, and the system was applied to precision measurement of bore thread abrasion of guns.
出处
《微电子学》
CAS
CSCD
北大核心
2007年第4期579-583,共5页
Microelectronics
关键词
光栅测量系统
数模混合集成电路
物理设计
布局布线
迭代
Grating measurement system
Mixed signal IC
Physical design
Placement and routing
Iteration
