摘要
影响镀通孔制程可靠性因素众多,关系复杂,需要一个有效的技术途径来研究该问题。文中总结了印制电路板镀通孔制程的各个加工步骤和工序的目的,以及制造过程中影响这些目的达成效果的影响因素。分析汇总了印制电路板镀通孔的各种失效模式和机理,及其对应的失效发生的部位和影响因素。在此基础上,明确了进行印制电路板镀通孔制程可靠性研究的技术途径,同时给出了实施这项研究的技术细节。
Manufacturing quality and workmanship is a key factor to the reliability of plated though holes （PTH） in primed circuit boards （PCB）. To conduct a study and investigate the factor needs to idemify and have an in-depth understanding of manufacturing reliability associated issues and determine an effective approach to implement the study. For this reason, this paper summarizes major manufacturing processes of PTHs. It provides a review of failure modes, mechanisms and locations that are associated with PTH manufacture processes. In this end, this paper provides an approach and necessary information for effectively conducting an experimental and theoretical research on PTH manufacture reliability.
出处
《印制电路信息》
2007年第8期28-33,共6页
Printed Circuit Information
关键词
印制电路板
镀通孔
制程可靠性
制程参数
失效机理
printed circuit board
plated through hole
manufacturing reliability
manufacture process control
failure mechanism
