摘要
概述了IST作为对印制电路板过孔和互连可靠性的一种测试手段的发展历史,测试条件和数据分析方法,展望了其今后的研究方向。
This paper summarizes IST as a test method for measuring plated through via and interconnect reliability in printed circuit boards, including its history, testing conditions and data analysis. Its future work is also mentioned.
出处
《印制电路信息》
2005年第6期58-62,共5页
Printed Circuit Information
