期刊文献+

手机按键面板光纤激光切割工艺研究 被引量:2

Study of Fiber Laser Cutting Techniques on Key Board for Mobile
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摘要 采用光纤激光精密切割系统,进行了手机金属按键面板的切割实验,研究了输出功率、切割速度、重复频率、脉冲宽度、辅助气体及气压等参数对手机金属按键面板切割质量的影响。通过试验和分析,获得了最佳工艺参数。采用激光器的输出功率为25W、重复频率为1800Hz和脉冲宽度为0.3ms,辅助气体O2压为0.25MPa,扫描速度为8mm/s,切割出高质量的手机按键面板。 The processing techniques including output power,frequency,cutting speed,pulse width and assistant air pressure, which influence the laser cutting quality of key board for mobile,have been studied with the fiber laser precision cutting system. The best processing techniques have been gained with the analysis and experiments. The high quality keystrokes for mobile have been cut with the output power of 25 W,the repeat frequency of 1800 Hz,the pulse length of 0.3 ms,the oxygen gas pressure of 0.25 MPa and the scanning speed of 8 mm/s.
出处 《光电子.激光》 EI CAS CSCD 北大核心 2007年第7期835-837,共3页 Journal of Optoelectronics·Laser
基金 广东省科技计划资助项目(2004B10201002) 广州市科技计划资助项目(2005Z3-D0241)
关键词 按键面板 激光加工 激光切割 加工工艺 keystroke laser processing laser cutting processing techniques
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