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硅基键合InP-InGaAsP量子阱连续激光器的研制 被引量:1

CW InP-InGaAsP Quantum-Well Laser on Si Fabricated by Wafer Bonding
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摘要 采用键合技术在Si基上制备了InP-InGaAsP量子阱激光器,实现了电注入室温连续工作.采用低温直接键合的方法,将Si衬底和InP-InGaAsP外延片键合在一起,并制成条宽6μm的脊波导边发射激光器.室温连续工作的1.55μm激光器阈值电流为48mA,对应的阈值电流密度和微分电阻分别为2.13kA/cm2和5.8Ω,在约220mA时输出光功率达15mW. A 1.55μm InP-InGaAsP quantum-well laser was fabricated on Si substrate by low-temperature wafer bonding, which lases at room temperature with electrical pumping. The InP epitaxy was designed and grown by MOCVD, then bonded to Si wafer. Finally,the laser with ridge-waveguide and edge-emission was fabricated. This laser runs continuous-wave with a threshold current of 48mA (current density of 1.65kA/cm^2) ,differential resistance of 5.8W at the threshold current, and a maximum output power of 15mW at 220mA.
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2007年第7期1117-1120,共4页 半导体学报(英文版)
基金 国家高技术研究发展计划(批准号:2003AA312010) 国家自然科学基金(批准号:60576035)资助项目~~
关键词 硅基激光器 连续激射 直接键合 Si-based laser continuous-wave lasing wafer bonding
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参考文献24

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