摘要
考察添加不同量的单环氧基活性稀释剂(H8)对环氧树脂体系固化反应以及介电性能的影响,通过DSC热分析发现,稀释剂添加量越多,DSC曲线放热峰越往高温方向移动,并且峰形变钝,放热过程的△HC基本上随稀释剂用量的增大而减小;由介电损耗-温度谱实验数据显示,随着稀释剂加入量增多,介电损耗值也呈上升趋势,但总体上tanδ还是保持在较低值范围内,155℃tanδ最大值不超过0.04。同时利用DSC跟踪体系固化反应过程,根据Kissinger和Crane方程对该固化反应进行了非等温动力学分析,探讨得出环氧树脂体系的固化动力学参数:固化反应表观活化能△Ea=48.3 kJ/mol,反应级数n=0.89。
The effect of the content of aliphatic monoepoxy- based reactive diluent H8 on cycloaliphatic epoxy/ carboxylic anhydride （MHHPA） impregnating system was studied by non - isothermal DSC and the dielectric performance was also examined. However, the impregnation system was improved but the dielectric performance of system was become a little worse and maintained with good electrical properties at 155 ℃, such as tanδ was still less than 0.04. by the adding of reactive diluent H8, From DSC it could be found that the peak was become less sharp and the peak temperature was increased as increasing the content of H8, while the average reaction energy △Hc was decreasesd. The kinetics of the curing processes were analyzed by Kissinger and Crane equations, based on which calculated the curing kinetic parameters of the curing systems： the activation energy △Ea = 48.3 kJ/mol, the reaction order value n = 0.89.
出处
《热固性树脂》
CAS
CSCD
2007年第3期10-12,16,共4页
Thermosetting Resin
关键词
稀释剂
环氧树脂
DSC
介电损耗
动力学
diluent
epoxy resin
DSC
dielectric dissipation factor
kinetics
