摘要
目的:使用低温等离子体表面处理技术处理树脂基托材料,观察材料表面化学成份及润湿性、粘接性的变化。方法:将试件置于低温等离子体装置中处理20min,并对等离子体处理前后的标本进行X射线光电子能谱分析和接触角的测量,进行剪切实验以测量粘接力。结果:等离子体处理后,树脂表面碳氧原子比例从1∶0.30升至1∶0.46;材料表面接触角明显下降;粘接强度比未处理前提高了1.6倍。结论:低温等离子体处理树脂材料表面可提高其润湿性及粘接性。
Objective： To observe the changes of chemical components, wettability and bonding strength on the surface of denture base resin by low temperature plasma treatment. Methods： Specimens of denture base resin were treated for 20 minutes in plasma equipment. Contact angles and bonding strength were measured. Chemical components were analysed by X -ray Photoelectron Spectroscopy（XPS）. The debonded interface of plasma untreated and treated resin were studied with Scanning Electron Microscope （SEM）. Results： After plasma treatment, the atomic ratio of C： O changed from 1：0.30 to 1 ： 0.46. Contact angle was significantly reduced. Bonding strengths of heat cured acrylic resin increased approximately 1.6 fold. Conclusion： Low temperature plasma treatment might be used to improve the surface wettability and bonding strength of denture base acrylic resin.
出处
《口腔医学研究》
CAS
CSCD
2007年第2期144-146,共3页
Journal of Oral Science Research
关键词
树脂
等离子体
粘接强度
接触角
Resin Plasma Bonding strength Contact angles
