摘要
焊锡粉是焊锡膏的主要成分,其质量的好坏对焊锡膏的印刷质量起着至关重要的作用。概述了焊锡粉的分类、性能及应用,并重点介绍了当前雾化法制备焊锡粉的技术与特点。结合制粉技术的发展,对球形焊锡粉新型制备技术进行了展望。
Solder powder is the main component of solder paste, and the quality of paste print mostly depend on the solder powder. Summarize the sort, capability and application of solder powder, review the current technology of vapour preparation. Look forward new preparation technology for producing spherical solder powder according to development of powder technology.
出处
《电子工艺技术》
2007年第2期63-66,70,共5页
Electronics Process Technology
关键词
表面组装
焊锡膏
焊锡粉
雾化法
Surface mount technology
Solder paste
Solder powder
Vapour
