摘要
利用ANSYS有限元模拟软件,通过对温度场与速度场的耦合数值模拟,分析了触变成形过程中充型温度对A356合金半固态浆料流动及温度分布的影响.模拟结果表明:当充型温度为590℃,压射速度为5 m/s时,半固态浆料充型平稳,没有形成喷溅和卷气现象,温度分布没有明显的热节区域形成,半固态浆料成形效果最理想,有利于获得充型完整、轮廓清晰、内部组织致密的半固态成形件.通过实验对数值模拟所获得的工艺参数进行了验证.
The FEA software ANSYS was applied to the numerical simulation coupling temperature field with velocity field to analyze the effect of mold filling temperature on the flow and temperature distribution of semi-solid slurry of A356 alloy during thixo-forming. The results showed that the semi-solid slurry is stable in filling process without spouting, air entrapment and hot spot area found in temperature distribution if the mold filling temperature is 590 ＂C with an injecting rate 5 m/s. Such conditions are ideal to the forming of semi-solid A356 alloy slurry because they are beneficial to getting fully filled semi-solid parts with clear contour and compact microstructure. The technological parameters obtained from numerical simulation are verified by tests.
出处
《东北大学学报（自然科学版）》
EI
CAS
CSCD
北大核心
2007年第3期353-356,共4页
Journal of Northeastern University(Natural Science)
基金
国家自然科学基金资助项目(50374031)
关键词
半固态成形
数值模拟
温度场
充型温度
凝固
充型过程
semi-solid forming
numerical simulation
temperature field
mold filling temperature
solidification
mold filling process
