摘要
以酚醛树脂为基体，加入B4c作为改性填料制备出高温粘结剂，并对si3N4陶瓷进行粘接。在300～800℃温度范围内对Si3N4陶瓷粘接试样进行热处理，并测试了不同温度热处理后的室温剪切强度。结果表明，经过700～800℃热处理后，粘结剂表现出较为理想的粘接性能，剪切强度测试结果为Si3N4陶瓷基体破坏。利用扫描电镜研究了粘接试样的断面形貌及胶层结构特征。研究表明，在高温热处理过程中，B4C改性填料发生了复杂的物理、化学变化，通过B4C与树脂挥发分之间的改性反应，有效提高了酚醛树脂热解后的残炭值，进而改善了粘接胶层结构的高温稳定性；纤维状物质的形成与B2O3颗粒的细化，有助于提高粘接胶层的连接强度。
High-temperature adhesive was prepared using phenol-formaldehyde resin （PF） as matrix and boron carbide （B4C） as modifier, silicon nitride （Si3N4） ceramics were bonded by the adhesive, and the bonded specimens were heat-treated within 300--800℃ subsequently. The adhesive properties of the high-temperature adhesive were tested. The results indicate that the adhesive has outstanding high-temperature bonding properties for Si3N4 at high temperature. The failure of bonded joints treated at 700 and 800 ℃ were due to the broken of Si3N4 matrix. The micro-morphologies at bonding interfaces were also investigated by SEM. It is shown that complex physical and chemical changes occurred during the heat-treatment process. By means of the modification reaction between B4C and the volatiles of PF resin, the value of carbon residue was prompted effectively; and the formation of fibers and the nanocrystallization of B2O3 benefit the achievement of satisfactory high-temperature bonding properties.
出处
《北京科技大学学报》
EI
CAS
CSCD
北大核心
2007年第2期178-181,共4页
Journal of University of Science and Technology Beijing
基金
国家自然科学基金资助项目(No.50303004)
江苏省自然科学基金资助项目(No.BK2004409)
东南大学优秀青年教师教学
科研资助计划(No.4012001003)
关键词
B4C
酚醛树脂
高温粘接剂
SI3N4
boron carbide
phenol formaldehyde resin
high-temperature adhesive
silicon nitride
