摘要
为了提高铜粉的热稳定性,采用滴入化学镀法在铜粉末表面包覆一层金属银,用SEM、X射线衍射(XRD)、粒度分布和热重分析表征了不同包覆厚度的镀银铜粉和原始铜粉的表面形貌、表面结构及抗氧化性。结果表明:铜粉表面镀层结构与银离子形核长大机制和银含量有关;镀银铜粉的热稳定与表面镀层结构有关;完全包覆结构的镀银铜粉具有较好的热稳定性,抗氧化温度可以达到800℃以上。
The micro silver-coated copper powder with high temperature of oxidation resistance was prepared by chemistry substitutional and chemistry plating reaction. The surface topography, microstructure and oxidation resistance of the coated powder were characterized by SEM, XRD, TG and other methods. It is found that the ploating structure of copper power is related to mechanism of nucleus forming and content of silver; Thermal stability is affected by plating structure of silver-coated copper power. Silver-coated copper powder with coated structure have higher thermal stability, it is not oxidized even at 800℃.
出处
《表面技术》
EI
CAS
CSCD
2007年第1期11-13,共3页
Surface Technology
关键词
铜粉
镀银
热稳定性
镀层结构
Copper power
Silver plating
Thermal stability
Plating structure
