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聚酰亚胺复合材料的热学性能研究 被引量:3

Study thermal performance of composite polyimide
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摘要 通过均苯四甲酸二酐(PMDA)与4,4-二氨基二苯基醚(ODA)缩聚反应制备出聚酰胺酸(PAA),而后采用溶胶-凝胶(sol-gel)法和超声波机械共混法制备出含纳米二氧化硅(nano-SiO2)、纳米三氧化铝(nano-Al2O3)、纳米二氧化钛(nano-TiO2)不同量的PPA/无机纳米共混胶液,经高温亚胺化得到聚酰亚胺(PI)/无机纳米复合材料。利用热学综合分析仪,在N2的保护下,以1℃/min升温速度,对复合材料的热失重、分解温度等热学性能进行分析比较。结果表明:无机纳米颗粒对聚酰亚胺材料的热失重温度的影响较小,提高聚酰亚胺的热失重、分解温度需要从改善聚酰亚胺分子结构出发。 Poly(amic acid)(PAA) were prepared through reacting condensation polymerization between pyromelitic dianhydride(PMDA) and 4. 4-oxydianiline (ODA), then PPA/ nanoparticles mixture with two nano-SiO2, nani-Al2O3, nano-TiO2 content different were prepared by process of ultrasonic mechanism mixing and solution-gelation(sol-gel) and imidized in the condition of the high temperature, so we can obtained the composite polyimide(PI)/inorganic nanoparticles. The thermostability of these materials was studied by thermogravimetry analysis in nitrogen with 1℃/min. The result showed that there were no differences in very great degrees among their thermal performance, it should change macromolecule main chain of PI in order to enhance thermal degradation.
出处 《化工新型材料》 CAS CSCD 北大核心 2007年第1期52-53,72,共3页 New Chemical Materials
基金 陕西理工学院院级科研资助项目:SLGQ00305
关键词 溶胶-凝胶 聚酰亚胺复合材料 热失重 无机纳米颗粒 sokgel, composite polyimide, thermogravimetry, inorganic nanoparticle
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  • 1张营堂.纳米SiO2/聚酰亚胺复合耐电晕薄膜研制[D].哈尔滨:哈尔滨理工大学,2004. 被引量:2
  • 2刘立柱,张营堂,梁冰,雷清泉.纳米二氧化硅/聚酰亚胺杂化膜制备方法及表征[J].哈尔滨理工大学学报,2004,9(1):99-101. 被引量:3
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