摘要
综述了活性法陶瓷-金属封接工艺的新进展,强调指出:返烧经研磨的瓷件,用活性法同样可以得到高质量的陶瓷-金属封接件。
Recent advanccs of ceramic to metal seal with active metal methods are reviewed in this paper. It puts emphasis on that a good seal quality can also be obtained by active process, if ceramics has been resintering after grinding.
出处
《真空电子技术》
2006年第4期62-65,共4页
Vacuum Electronics
关键词
陶瓷-金属封接
活性法
新进展
质量
再烧结
Ceramic to metal seal
Active method process
New progress
Quality
Resintering
