摘要
通过对一种高密度密封电子设备的设计实践,阐述了密闭设备结构热设计中的设计思想及一些具体散热结构。同时应用Flotherm热分析软件进行结构热设计验证与优化,从而对多种分析结果比较,并找出了适合该设备的散热模型,以供实际应用借鉴。
Through design practice of high - density sealed electronic equipment, the design ideas and several specific cooling methods in structure thermal design are described. Meanwhile, verification and optimization by applying Flotherm thermal analysis software were carried out. By comparing the resuits, we have found the model suitable for the sealed electronic equipment. The optimized design can be used in practical application.
出处
《电子工艺技术》
2006年第6期339-343,共5页
Electronics Process Technology
关键词
热设计
结构优化
密闭设备
导热板
Thermal design
Structure optimization
Sealed equipment
Heat - conducting plate
