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玻璃基片双面光刻对准工艺流程的研究 被引量:2

Study on the Alignment Technology Process of Double-Sided Lithography on Glass Substrate
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摘要 介绍了双面光刻对准原理及技术新发展,表明了不变焦对准的技术优势。针对玻璃基片设计了十字加方框的对准图样,经重新调焦,利用基片透明属性透过基片标记观测掩模标记实现对准,不再采用静态存储的掩模数字图像作为精对准基准,规避了可能由物镜侧移带来的对准误差。最后提供了几种常用的对准标记图样,并为了加工操作的便利引入了辅助搜索线。 The alignment principle of the double-sided mask etching and its new development were introduced, and the advantage of the stable-focus-plane alignment technology was manifested. A type of alignment key for glass substrate, a solid crosshair embedded in a pane, was designed. The alignment was carried out by refocusing to view the real-time image of the key on the mask through the transparent area of substrate key, rather than by comparing with the prestored static digital image of the mask which is regarded as a routine benchmark, therefore the registration error caused by lateral movement of the objectives during the process of focus adjusting is avoided. Subsequently, several styles of common used alignment keys are presented, and a method to manufacture an auxil iary searching line is also proposed to operate equipment conveniently.
出处 《半导体技术》 CAS CSCD 北大核心 2006年第8期576-578,共3页 Semiconductor Technology
基金 航天支撑技术基金项目(编号不公开)
关键词 镀膜 双面光刻 双面对准 对准标记 mask double-sided lithography double-sided alignment alignment key
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参考文献2

  • 1MALUF N. An introduction to microelectromechanical systems engineering(Chapter 3)[M]. Boston, MA,USA, Artech House MEMS Library, 2000:54 -- 57. 被引量:1
  • 2BRUBAKER C, WIMPLINGER M, MALZER A, et al.Advances in processing of compound semiconductor substrates [C]//Int Conf on Compouud Semiconductor Manufacturing Technology. New Orleans, LA, United States, 2005. 被引量:1

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