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电铸Ni-SiC金属基复合材料的抗拉强度与微观结构分析 被引量:5

The Analysis of Tensile Strength and Microstructure of Ni-SiC Composites Prepared by Electroforming
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摘要 在氨基磺酸镍镀液中电铸制备了两种不同SiC微粒含量的复合材料,研究了热处理对复合材料的抗拉强度和微观组织的影响.研究表明,300℃热处理提高了两种复合材料的强度;但600℃热处理却降低了强度.基体金属Ni与SiC颗粒在600℃完全反应后,界面反应产物是Ni3Si、游离石墨和少量的Ni31Si12,并且产生相当于SiC微粒体积8%的微孔.断裂过程经历微裂纹萌生、长大和聚集,以基体断裂、界面脱粘和微粒断裂三种方式进行. Ni-SiC metal matrix composites with two kinds of SiC content were prepared by electroforming in a nickel sulphamate bath. The effect of heat treatment on tensile strength and microstructure of Ni-SiC composites were investigated. The heat treatment at 300℃ increases tensile strength, but the heat treatment at 600℃ decreases the tensile strength. The complete reaction between nickel and SiC particles can produce shrinkage pores in the interface. In addition, the volume of shrinkage pores is equal to 8% of that of SiC particles in the composites. The interfacial reaction products are composed of Ni3Si and a little amount of Ni31Si12 at 600℃. The fracture process includes microcracks initiation, growth, and coalescence. The cracking of the matrix, debonding of Ni-SiC interface and cracking of particles are three types of cracking modes.
出处 《上海交通大学学报》 EI CAS CSCD 北大核心 2006年第1期120-123,128,共5页 Journal of Shanghai Jiaotong University
基金 国家高技术研究发展计划(863)项目(2002AA334010) 上海市科委重点新材料项目(035211037) 上海市科技发展基金项目(0211nm052)
关键词 电铸 Ni—SiC复合材料 抗拉强度 微观结构 界面反应 断裂 electroforming Ni-SiC composite tensile strength microstructure interfacial reaction fracture
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