期刊文献+

Y掺杂Al_2O_3高k栅介质薄膜的制备及性能研究 被引量:1

Fabrication and properties of the Y-doped Al_2O_3 high-k gate dielectric films
原文传递
导出
摘要 利用射频反应共溅射方法制备了Y掺杂Al2O3电介质薄膜,用掠入射x射线衍射检测了薄膜的结构,用高分辨率扫描电子显微镜(HRSEM)、原子力显微镜(AFM)观察了薄膜断面和表面形貌,用高频C_V和变频C_V及J_V测量了样品的电学特性.结果表明,Y的掺入使电介质薄膜的介电常数k有了很大提高(8.14—11.8),并体现出了较好的介电特性.分析认为与氧具有较大电负性差的Y离子的加入,增大了薄膜中的金属—氧键(M—O)的强度;同时,Y的加入使Al2O3的结构和原子配位发生了改变,从而提高了离子极化对薄膜介电常数的贡献.退火前后的XRD谱均显示薄膜为非晶态;HRSEM断面和AFM形貌像显示所制备的薄膜非常平整,能够满足器件要求. Y-doped Al2O3 dielectric films have been fabricated by reactive radio frequency co-spnttering method. Grazing angle incidence x-ray diffraction results show that the as-deposited and annealed films are amorphous. High resolution scanning electron microscope and atomic force microscope have been applied to observe the cross-section and the surface morphology of the thin films. The electric C- V and I- V characteristics were measured at high and variable frequency, respectively. It was found that the dielectric constant k of the films increases remarkably (from 8.14 to 11.8) with increasing Y-doping concentration. The Y-O bond is stronger than Al-O due to the obvious difference in electro-negativity between the two bond members, which enhanced the ionic polarization in the thin films leading to an increase of the dielectric constant. It was supposed that the presence of Y ions changed the structure and atomic coordination of Al2O3 . The films were very smooth which meets the requirements of the device.
机构地区 兰州大学物理系
出处 《物理学报》 SCIE EI CAS CSCD 北大核心 2005年第12期5901-5906,共6页 Acta Physica Sinica
基金 国家自然科学基金(批准号:50272027)资助的课题.~~
关键词 高K栅介质 掺杂氧化铝 射频反应溅射 high-k gate dielectric, doped Al2O3 , reactive radio frequency sputtering
  • 相关文献

参考文献9

二级参考文献10

  • 1[1]Hoshino Y, Kido Y, Yamamoto K et al 2002 Appl. Phys. Lett. 812650 被引量:1
  • 2[2]Miyake S, Shimizu I, Manory R R et al 2001 Surf. Coat.Technol. 146-147 237 被引量:1
  • 3[3]Park B K, Park J, Cho M et al 2002 Appl. Phys. Lett. 80 2368 被引量:1
  • 4[4]Conley J F Jr, Oho Y, Solanki R et al 2003 Appl. Phys. Lett. 823508 被引量:1
  • 5[5]Miyata N, Ichikawa M, Nabatame T et al 2003 Jpn. J. Appl.Phys. 42 L138 被引量:1
  • 6[6]Green M L, Ho M Y, Busch B et al 2002 J. Appl. Phys.927168 被引量:1
  • 7[7]Lysaght P S, Foran B, Bersuker G et al 2003 Appl. Phys. Lett.82 1266 被引量:1
  • 8[8]Gutowski M, Jaffe J E, Liu C L et al 2002 Appl. Phys. Lett. 801897 被引量:1
  • 9[9]Chin A, Chen W J, Chang T et al 1997 IEEE Electron. Dev.Lett. 18 417 被引量:1
  • 10[10]Han D D, Kang J F, Lin C H et al 2003 Chin. Phys. 12 325 被引量:1

共引文献35

同被引文献2

引证文献1

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部