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一种低延迟低功耗的片上全局互连方法 被引量:2

A Low-Latency Low-Power Scheme for On-Chip Global Interconnects
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摘要 提出了一种用于片上全局互连的混合插入方法.该方法利用中继驱动器和低摆幅差分信号电路在驱动不同长度连线时的优点,将它们混合插入到连线的合适位置,从而降低互连的延时和功耗.模拟结果表明,该方法与已有方法相比在延时、能耗、能耗延时积以及面积等方面都获得了一定程度的改善. A hybrid insertion scheme for on-chip global interconnects is presented. The scheme takes advantages of repeaters and low-swing differential-signaling circuits on driving long wires in different length, and optimally inserts them along the wire in order to decrease delay and power of interconnects. It is shown that the delay, energy, delay-energy-product, and area are all considerably decreased compared with other available schemes.
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2005年第9期1854-1859,共6页 半导体学报(英文版)
基金 国家高技术研究发展计划(批准号:2004AA1Z1040) 国家自然科学基金(批准号:60473079)资助项目~~
关键词 片上互连 延时 能耗 面积 低摆幅 差分信号 on-chip interconnect delay energy area low-swing differential-signaling
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参考文献16

  • 1Semiconductor Industry Assoc. International technology roadmap for semiconductors(ITRS). San Jose,CA,2001. 被引量:1
  • 2Rabaey J M, Chandrakasan A, Nikolic B. Digital integrated circuits: a design perspective. 2nd edition. Prentice Hall ,2003. 被引量:1
  • 3Bakoglu H B. Circuits, interconnections and packaging for VLSI. Addison-Wesley Publishing Company, 1990. 被引量:1
  • 4Banerjee K,Mehrotra A. A power-optimal repeater insertion methodology for global interconnects in nanometer designs.IEEE Trans Electron Devices,2002,49(11) :2001. 被引量:1
  • 5Li Ruiming,Zhou Dian,Liu Jin,et al. Power-optimal simultaneous buffer insertion/sizing and wire sizing. IEEE/ACM International Conference on Computer Aided Design (ICCAD),San Jose, California, USA, 2003. 被引量:1
  • 6Shah H,Shin P,Bell B,et al. Repeater insertion and wire sizing optimization for throughput-centric VLSI global interconnects. IEEE/ACM International Conference on Computer Aided Design (ICCAD), San Jose, California, USA, 2002. 被引量:1
  • 7Zhang H, George V, Rabaey J M. Low-swing on-chip signaling techniques: effectiveness and robustness. IEEE Trans Very Large Scale Integrated Systems, 2000,8(3): 264. 被引量:1
  • 8Massoud Y,Kawa J,MacMillen D, et al. Modeling and analysis of differential signaling for minimizing inductive crosstalk. Design Automation Conference (DAC), Las Vegas, Nevada, USA, 2001. 被引量:1
  • 9Hatirnaz I,Leblebici Y. Twisted differential on-chip interconnect architecture for inductive/capacitive crosstalk noise cancellation. International Symposium on System-on-Chip(SoC), Tampere, Finland, 2003. 被引量:1
  • 10Ho R. On-chip wires:scaling and efficiency. PhD Dissertation,Stanford University, 2003. 被引量:1

同被引文献24

  • 1Randu Marculescu. Outstanding Research Problem in NoC Design: System, Microarchitecture, and Circuit Perspectives [J]. Computer-Aided Design of Integrated Circuits and Systems,2009, 28(1):3-21. 被引量:1
  • 2Fayez Gebali, Haytham Elmiligi, Mohamed Watheq El-Kharashi, Networks-on-Chips-Theory and Practice[M]. [S. l. ]: CRC Press, 2009. 被引量:1
  • 3Chen Chia-Hsin Owen. A Low-swing Crossbar and :Link Generator for Low Power Network-on-Chip[J]. Computer-Aided Design, 2011(18) : 779-786. 被引量:1
  • 4Liu Xiangyuan, Chen Shuming. Delay and Power Estimation Models of Low-swing Interconnects for Design Planning [C]//Proceedings of the 16th ACM Great Lakes Symposium on VLSI. New York: [s. n. ], 2006:91-94. 被引量:1
  • 5Hu Yuanfang, Zhu Yi,Chen Hongyu. Communication Latency Aware Low Power NoC Synthesis[C]//Proceedings of the 43rd Annual Design Automation Conference ACM. San Francisco: [s. n.],2006:574-579. 被引量:1
  • 6Pinto A. COSI: A Framework for the Design of Interconneetion Networks[J]. Design & Test of Computers, 2008,25 (5):402-415. 被引量:1
  • 7Sotiriadis P P. Interconnect modeling and optimization in deep submicron technologies. PhD Dissertation, Massachusetts Inst Technol, Cambridge, May 2002. 被引量:1
  • 8International Technology Roadmap for Semiconductors. Semiconductor Industry Association,2003. 被引量:1
  • 9Sylvester D, Keutzer K. Getting to the bottom of deep submicron Ⅱ : the global wiring paradigm. Proc ISPD, 1999. 被引量:1
  • 10Zhang Y, Lach J, Skadron K, et al. Odd/Even bus invert with two- phase transfer for buses with coupling. Proc ISLPED,2002:80. 被引量:1

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