摘要
孔隙率是检验镀层质量的一个重要指标,它标明了镀层对基体防护作用的优劣程度。为了减少传统孔隙率测量方法造成的测量误差,更有效便捷地对镀层的孔隙率进行测量计算,在金相显微镜和CCD摄像头的基础上开发用于测定镀层孔隙率的软件。其测定过程是先用金相显微镜和CCD摄像头进行镀层表面的图像采集。然后对镀层孔隙图像进行阈值分割,将孔隙从背景中分离出来,然后用像素标记法对每个孔隙进行标记,最后自动进行孔隙个数自动计数及相关参数的计算。这样除了可以得到孔隙率,还可以得到孔隙的面积分布,进行孔隙均匀性判断。
As one of the important indexes for the quality rating of plating, porosity can be used to evaluate the protection effectiveness of the substrate by the plating. However, the traditional porosity analysis of coating and plating is greatly limited by time-consuming manual counting of the porosity. Thus a software capable of automatic measurement of the coating porosity was developed by combining metallurgical microscope and CCD camera, which makes it feasible to reduce the measurement error and facilitate the measurement of the porosity in a more efficient and simple manner. Accordingly, the surface image of the plating was captured using a metallurgical microscope and CCD camera, and a threshold separation was carried out to separate the pores on the surface from the background. After labeling every pore making use of pixel marking method, the number of the pores was counted and the related parameters were automatically calculated. Subsequently, the porosity of the plating and the area distribution of the pores could be determined, which made it feasible to estimate the distribution uniformity of the pores.
出处
《材料保护》
CAS
CSCD
北大核心
2005年第9期70-72,共3页
Materials Protection
关键词
电镀
孔隙率
图像分析
electroplating
porosity
image analysis
