摘要
近些年来,印制电路板业界对环境保护的要求迅速升温.该公司已经开发并掌握了无卤核心技术.包括树脂体系技术和高填充量控制技术.作为树脂技术,开发了一种新型的树脂体系(RO树脂),它的特点是将大量的氮引入到分子主链结构中;而高填充量控制技术的核心则是开发了一种新的填料界面控制系统(FICS),它能使填料有足够高的分散度.采用这些技术,可以制成符合要求的多种无卤型基材.包括MCL-RO-67G(下面讨论的TL-A),用作多层PWB的薄型层压板MCF-4000G(后面将讨论的HD-B),用于高密度互连的增层法基材MCL-E-679F(G)(文章中讨论的HiTg),以及用于先进芯片塑料封装(PKGs)的高Tg层压板和PWB.这些基材有着优异的耐热性,并且很适合于无铅焊锡互连.与通用的基材相比,这些基材对于温度、潮湿和频率有着更好的稳定性.采用这些新型基材使环保型产品的设计、制造变得非常之容易.该公司还正在研发不久的将来所需要的适用于高频、高速、高可靠性PWB基材以及新型封装用基材.
Recently, the requirement of the primed wiring boards （PWBs） of environmental harmonyty pe rises rapidly. We have developed the core technologies of halogen-free. They consist of resin system technology and high filler content technology. The point of the resin technology is the development of a new resin system （RO resin） which takes nitrogen into the molecule frame in a large quantity. The point of the high filler content technology is the development of a new filler interphase control system （FICS） which enables the high dispersion of fillers. A variety of halogen-free substrates which can be applied to the diversified needs have been developed by combining these technologies. They are MCL-RO-67G （hereafter referred to as TL-A）, thin laminate for the multi-layer PWBs, MCF-4000G（hereafter referred to as HD-B）, build-up material for high density interconnect （HDI）, and MCL-E-679F（G） （hereafter referred to as HiTg）, high Tg laminate for the advanced plastic IC packages （PKGs） and PWBs. These materials have excellent heat-resistance, and are suitable for lead-free solder as well. The robustness towards temperature, humidity and frequency of those materials are better than that of current materials. The synthetic board design of the environmental harmony type becomes easy by combined use of these materials.. We are also developing several multilayer and build up materials, HDI for high frequency, high speed and high reliability application to meet the PWBs and advanced PKGs requirement for the near future.
出处
《覆铜板资讯》
2005年第4期16-21,13,共6页
Copper Clad Laminate Information
