摘要
主要介绍了Sn-Pb合金焊接点发生失效的各个失效阶段的各种表现形式,探讨发生失效的各种原因,如热应力与热冲击、金属的溶解、基板和元件过热、超声清洗的损害,以及如何在工艺上进行改进以改善焊点的可靠性,使焊点有良好的可靠性、不易损坏,能够承受变化的负载等,从而提高产品的质量。
Various kinds of failures in Sa-Pb solder joints are introduced and their causes are discussed, including thermal stress and shock, melting, substrate and compoments overbearing, and damage by ultrasonic cleaning. The methods for improveing the process are suggested to improve the quality and reliability of solder joints.
出处
《电子产品可靠性与环境试验》
2005年第2期31-34,共4页
Electronic Product Reliability and Environmental Testing
关键词
焊点
失效
质量
solder joint
failure
quality
