摘要
主要介绍了Sn-Pb合金焊接点发生失效的各种表现形式,探讨发生的各种原因及如保在工艺上进行改进以改善焊点的可靠性,提高产品的质量。
All kinds of failures in solder joint are introduced, whose causes are studied. How to improve joint's quality and reliability is also studied.
出处
《印制电路信息》
2004年第8期58-61,共4页
Printed Circuit Information
