摘要
对Nd∶YAG固体激光器倍频、三倍频激光输出在空气和水浴环境下刻蚀Si片进行了研究,分析了刻蚀速率和样品表面形貌,得出了在355nm刻蚀波长下,水浴环境中,刻蚀速率最快,刻槽宽度最小,小于10μm的实验结论。
It is reported that the slot of microcutting Si wafer by second and third harmonic output of YAG laser is narrower in water bath than in air environment. The surface morphology and etching rate for water bath and air environment are compared in detail. The cutting gap as small as 10 μm with edge fluctuation less than 5 μm is obtained in water bath by 355 nm laser. This technology may be helpful for industrial applications.
出处
《光子学报》
EI
CAS
CSCD
北大核心
2005年第3期340-342,共3页
Acta Photonica Sinica
基金
国家自然科学重点基金(10334110)资助项目
关键词
YAG固体倍频激光
切割
Si片
水浴
Harmonic output of YAG laser
microcutting
Si wafer
Water bath
