摘要
随着集成度不断提高,集成电路的内绝缘层愈来愈薄,其互连线与间距愈来愈小,相互击穿电压愈来愈低,静电防护的重要性更加突出。简述了电子产品集成过程中静电防护的实践,在工程中解决了静电接地、静电防护等技术问题。
As degree of integration increasing,for integrate circuit,inner insulated layers become thinner,interlinked lines become slenderer and space between becomes smaller.Breakdown voltage is lower and lower.Significance of electrostatic discharge avoidance emerges.Recommend practices on electrostatic discharge avoidance in assembly process and some methods for static electricity grounding,electrostatic discharge avoidance.
出处
《电子工艺技术》
2005年第2期85-87,91,共4页
Electronics Process Technology
关键词
静电
接地
静电控制
静电评价
Static electricity
Grounding
Electrostatic discharge control
Static electricity justification
