摘要
印制板通孔的金属化是一个极其复杂的过程,它涉及到去残渣、活化、化学镀铜和电镀铜,为了得到品质优良的产品,必须严格控制每一项操作。本文通过对生产现场易出现的问题,提出了对上述各工序管理的注意点。
Through hole plating of printed circuit board is a very complicated process. Hole metallization involves the procedures of dismear, activation, electroless plating and electroplate copper. We must strictly control every part of the operation so as to produce top-grade products. In the paper we will bring up several cautions in the working procedures mentioned above, which quite often come out at the producing spot.
出处
《印制电路信息》
2003年第7期42-45,共4页
Printed Circuit Information
