期刊文献+

用激光微细加工制作平面型InGaAs/InPPIN光探测器 被引量:2

Fabrication of planar InGaAs/InP PIN photodiodes using laser assisted microprocessing
下载PDF
导出
摘要 采用激光微细加工技术来制作单片集成光接收机的探测器,在制作过程中,用固态杂质源10.6 μm激光诱导Zn扩散工艺来进行探测器的p 区掺杂。制作出平面型顶部入射的InGaAs/InPPIN光探测器, 响应度为0.21A/W。分析了激光诱导扩散中影响探测器性能的因素,因此提出了扩散温度自动控制、扩散区 温度分布均匀化及激光焦斑与扩散区精确对准等相应的改进方法。 As the fundamentals of the fabrication of monolithically integrated optical receiver, a photodiode has been fabricated using laser assisted microprocessing. Laser induced local zinc diffusion has been used to form the p-n junction of the photodiode. The diffusion process was implemented by using the focused laser spot to heat the diffusion window. A spin-on film doped by Zn was used as the diffusion source. Lithography, passivation, electrodes fabrication and packaging are conventional, as the wafers don't endure high temperature in these steps. The responsivity of the fabricated Planar InGaAs/InP PIN photodiodes arrived 0.21 A/W. It was found that some factors in the laser induced diffusion process caused the low performance of the photodiodes. Then improvements including the automatic controlling of the diffusion temperature, the flatting of temperature distribution in the small diffusion region, and the aligning of the invisible laser focus spot and the diffusion region are proposed.
出处 《强激光与粒子束》 EI CAS CSCD 北大核心 2005年第1期13-16,共4页 High Power Laser and Particle Beams
基金 国家自然科学基金资助课题(60277008) 教育部重点科技项目资助课题(03147) 中国电子科技集团电子科学研究院资助课题
关键词 激光微细加工 单片集成光接收机 PIN光探测器 激光诱导扩散 Laser applications Micromachining Monolithic integrated circuits Semiconducting indium gallium arsenide Semiconducting indium phosphide
  • 相关文献

参考文献8

  • 1叶玉堂编著..激光微细加工[M].成都:电子科技大学出版社,1995:295.
  • 2李忠东,叶玉堂,洪永和,叶婧,李家旭.连续波激光诱导扩散区温度的不接触测量[J].应用科学学报,1997,15(4):413-417. 被引量:11
  • 3李永平,陈德伟,王炜.应用于光束均匀化整形的SAGAGD算法[J].强激光与粒子束,2002,14(1):60-64. 被引量:4
  • 4谭峭峰,严瑛白,金国藩,邬敏贤,徐端颐.菲涅耳区衍射光学束匀滑器件的设计[J].强激光与粒子束,2003,15(2):125-128. 被引量:2
  • 5Bach H G, Beling S, Mekonnen G G, et al. Design and fabrication of 60-Gb/s Inp-based monolithic photoreceiver OEICs and modules[J].IEEE Journal of Selected Topics in Quantum Electronics, 2002, 8(6): 1445-1450. 被引量:1
  • 6Shimizu N, Murata K, Hirano A, et al. 40-Gbit/s monolithic digital OEIC composed of unitravelling-carrier photodiode and InP HEMTs[J]. Electronics Letters, 2000, 36(14): 1220-1221. 被引量:1
  • 7Skirimshire C P, Farr J R, Sloan D F, et al. Reliability of mesa and planar InGaAs PIN photodiodes[A]. IEE Proceedings[C]. 1990, 136(1): 74-78. 被引量:1
  • 8Wang G, Yoneda Y, Hanawa I, et al. Highly reliable high performance waveguide-integrated InP/InGaAs PIN photodiodes for 40 Gbit/s fibre-optical communication application[J]. Electronics Letters, 2003, 39(15) : 1147-1149. 被引量:1

二级参考文献15

共引文献14

同被引文献18

引证文献2

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部