摘要
详细描述一种等离子体高效溅射系统及应用工艺。此种崭新的溅射技术结合了蒸发镀的高效及溅射镀的高性能特点,特别在多元合金以及磁性薄膜的制备,具有其他手段无可比拟的优点。
Introduces the High Target Utilization Plasma Sputtering Technology. This brand-new sputtering technology combines the advantages of evaporation deposition and sputtering deposition, especially it is availabe to utilize for preparing multi-alloy and magnetic films. It has the unique advantages in comparison with other thin film technologies.
出处
《真空》
CAS
北大核心
2005年第1期43-45,共3页
Vacuum
关键词
高利用率等离子体溅射
共溅射
汇聚线圈
High Target Utilization Plasma Sputtering(HiTUS)
co-sputtering
convergence coil
