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半导体晶圆制造中的设备效率和设备能力 被引量:6

Equipment Efficiency and Equipment Capacityin Semiconductor Wafer Fab
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摘要 在半导体制造车间中,设备是非常昂贵的,设备折旧与维修占生产成本组成的最大比重,设备利用率的提高显得尤为重要,因此设备效率和设备能力已成为半导体制造者最关心的问题之一。本文针对该问题,系统地介绍了半导体晶圆制造中设备效率和设备能力的衡量标准及其数据收集,以期达到提高设备利用率的目的。 As depreciation and maintenance costs of the expensive equipments account for a bigpart in production costs, semiconductor manufacturers strive to run their equipments as efficientlyas possible. This paper describes briefly the measurement of equipment efficiency and equipmentcapacity and introduces mainly its applications in semiconductor wafer manufactory.
作者 梁静 钱省三
出处 《半导体技术》 CAS CSCD 北大核心 2004年第9期35-38,共4页 Semiconductor Technology
关键词 半导体晶圆制造 设备效率 设备能力 设备利用率 OEE equipment efficiency equipment capacity semiconductor manufacturing
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参考文献4

  • 1俞静,钱省三.半导体晶圆车间的成本控制方法[J].半导体技术,2003,28(8):11-14. 被引量:3
  • 2[2]SEMI E10-Standard for Definition and Measurement of Equipment Reliability, Availability, and Maintainability[S]. 被引量:1
  • 3[3]SEMI E79-Standard for Definition and Measurement of Equipment Productivity[S]. 被引量:1
  • 4[4]LEACHMAN R. C. Closed-Loop Measurement of Equipment Efficiency and Equipment Capacity[J].IEEE Transactions on Semiconductor Manufacturing,1997, 10(1):84-97. 被引量:1

二级参考文献7

  • 1[日本]田中一成著俞纯麟译.图解全面成本管理[M].上海:文汇出版社,2002.. 被引量:1
  • 2OECHSNER R, PFEFFER M, PFITZNER L,et al. From Overall Equipment Efficiency(OEE) to Overall Fab Effectiveness. Materials Science in Semiconductor Processing 5 (2003) 333-339. 被引量:1
  • 3IWATA Y and WOOD S C, Member, IEEE. Simple Cost Models of High-Process-Mix Wafer Fabs at Different Capacities. IEEE Transaction on Semiconductor Manufacturing, VOL.15, NO.2, MAY 2002. 被引量:1
  • 4SEMI E35-0701-Cost of Ownership for Semiconductor Manufacturing Equipment Metrics. 被引量:1
  • 5SEMI E79-0200-Standard for Definition and Measurement of Equipment Productivity. 被引量:1
  • 6SEMI Draft Document 3435-Provisional Guideline for Definition and Calculation of Overall Factory Efficiency(OFE) and other Associated Factory-Level Productivity Metrics. 被引量:1
  • 7俞静,钱省三,邵志芳.半导体制造车间设施规划浅析[J].半导体技术,2003,28(6):21-24. 被引量:6

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